Dishan Technology R&D Center: Sino German Cooperation Plans New Blueprint for AI Computing Power
Overview
Against the backdrop of the global artificial intelligence (AI) industry advancing into the deep-water zone driven by computing power, computing power has emerged as a core factor determining the iteration speed of AI technologies, the efficiency of application implementation, and industrial competitiveness. As the scale of AI models grows exponentially—ranging from large language models with hundreds of billions of parameters to real-time autonomous driving systems—the demand for computing power has become increasingly prominent. In this context, the independent controllability and innovative breakthroughs of computing power infrastructure have become a top priority of national science and technology strategies. As an important participant in China's AI ecosystem construction, Dishan Technology has joined hands with Germany’s AragF Technology to launch a brand-new AI.GPU technology solution, relying on the jointly established **Sino-German AI Computing Power Joint Laboratory**. The solution is committed to addressing the bottlenecks in domestic high-end computing power, building an independent, controllable, open and collaborative high-performance computing infrastructure system, and helping China seize the technological high ground in the global AI competition.
Core Positioning of the Solution: Technology Introduction + Joint Innovation + Local Empowerment
Dishan Technology’s AI.GPU technology solution is not a simple hardware integration, but a systematic ecological construction project following the path of "technology introduction—joint innovation—local mass production". This path is chosen based on profound insights into the current global computing power landscape: on the one hand, internationally advanced GPU technologies dominate the high-performance computing field, but supply chain risks and export restrictions are intensifying day by day; on the other hand, China's domestic AI industry is in urgent need of an independently controllable computing power base with international competitiveness. Through in-depth cooperation with Germany’s AragF Technology, Dishan has introduced the latter’s world-leading core strengths in GPU hardware design, underlying architecture optimization, and energy efficiency management—for instance, its proprietary **dynamic load scheduling algorithm** can increase chip utilization by 20%, while the **heterogeneous memory hierarchical architecture** has achieved a breakthrough in TB-level data throughput efficiency. Combined with Dishan Technology’s in-depth understanding of Chinese market application scenarios and its software ecosystem adaptation capabilities, the two parties have jointly developed a localized AI computing power base characterized by high performance, high compatibility, and high cost-effectiveness.
The solution precisely targets the current domestic pain points such as reliance on imported high-end GPUs, imperfect software ecosystems, and high computing power costs. By adopting the model of "introduction, digestion, and re-innovation", it realizes technological breakthroughs and industrial implementation. For example, to tackle the stability issues of domestic AI chips in complex model training, the joint laboratory has developed an **adaptive fault-tolerant mechanism**, which reduces the training interruption rate to below 0.5%, reaching world-class standards. This series of innovative measures aims to fill the gap in the local high-end computing power ecosystem, provide solid support for the intelligent transformation of thousands of industries, and drive China’s transformation from a "major computing power country" to a "powerful computing power country".
Core Technical Advantages: Breaking Performance Boundaries and Reshaping Computing Power Experience
#High-Performance Heterogeneous Computing Architecture: A Dual Revolution in Computing Power and Energy Efficiency
- Adopting a customized GPU core design, a single chip integrates over 50 billion transistors and supports ultra-large-scale parallel computing, which increases the training speed of large language models such as BERT by more than 3 times.
- The innovatively designed **on-chip network interconnection architecture** optimizes memory bandwidth and data paths, increasing computing power density by 40% at the same power consumption and breaking the "power wall" limitation of traditional GPUs.
- Supporting multiple precision modes including FP16, BF16, and INT8, it flexibly adapts to diverse scenarios from cloud inference to edge computing. For example, in the quality inspection scenario of smart factories, the inference latency under INT8 precision is reduced to the millisecond level, meeting real-time requirements.
Full-Stack Software-Hardware Collaborative Optimization: Unlocking the "Last Mile" of Computing Power Release
- The independently developed AI computing middleware platform **Zhiyu OS** is deeply integrated with mainstream frameworks such as PyTorch 2.0 and TensorFlow 3.x, and provides a one-click model migration tool, improving development efficiency by 50%.
- The launched **AI operator acceleration library** conducts underlying optimization for core algorithms such as Transformer and convolutional neural networks (CNNs), boosting the inference performance of typical models by 25%.
- Integrated with a distributed training scheduling system that supports 10,000-card-level cluster management, it has achieved trillion-level data processing capability in seconds in the financial risk control scenario, setting a new industry record.
#Scenario-Oriented Vertical Optimization Capabilities: Making Computing Power More Aligned with Industry Needs
- In the field of intelligent manufacturing, hardware-accelerated ray tracing algorithms increase the processing speed of industrial 3D point clouds by 5 times, facilitating defect detection of precision parts.
- For autonomous driving, a dedicated computing unit has been developed to accelerate the BEV perception algorithm, enabling millisecond-level fusion processing of 4D millimeter-wave radar and visual data.
- In the biomedicine field, the GPU-accelerated molecular dynamics simulation platform shortens the protein structure analysis time from months to days, accelerating the new drug research and development process.
R&D and Industrialization Layout: Full-Chain Breakthroughs from Laboratory to Mass Production
Relying on the Sino-German AI Computing Power Joint Laboratory located in Shanghai, Dishan Technology is accelerating the localized implementation of AI.GPU technology:
R&D Rhythm**: The first batch of research results is expected to be released in 2026, covering next-generation GPU prototype chips, AI computing platform architectures, and key software stacks. Among them, the first mass-produced chip based on 12nm process has completed tape-out verification, with an actual measured computing power of 200 TFLOPS.
Intellectual Property Goals**: Over the next three years, the company plans to apply for more than 100 core technology patents covering architecture design, energy efficiency optimization, software adaptation and other fields, building a "patent moat". Currently, the authorized patent for **dynamic precision adaptive technology** has filled the domestic gap.
Standard Participation**: Leading the formulation of 3 national standards including the *Energy Efficiency Evaluation Specification for Artificial Intelligence Accelerator Chips*, and collaborating with IEEE to promote the internationalization of GPU interconnection protocols.
Production Capacity Planning**: Joining hands with domestic advanced packaging and manufacturing resources, the first dedicated AI GPU production line will be built in the Yangtze River Delta region, with a planned annual production capacity of over 500,000 chips, forming a complete industrial chain closed loop from design to packaging and testing.
Ecological Co-construction and Open Cooperation: Building an AI Computing Power "Circle of Friends"
Upholding the philosophy of "openness, collaboration, and sharing", Dishan Technology is promoting the construction of a local AI computing power community:
- Cooperating with the national key laboratory "AI Chip Joint Laboratory" to carry out cutting-edge research on computing-in-memory and brain-inspired computing.
- Opening the **Zhiyu AI Open Platform** to developers, providing billions of FLOPS of computing resources, model toolchains, and scenario-specific SDKs.
- Establishing special laboratories in vertical fields such as autonomous driving and smart healthcare, and jointly developing industry-specific customized solutions with enterprises including Horizon Robotics and United Imaging Healthcare.
- Attracting more than hundreds of upstream and downstream enterprises engaged in chip design, algorithm development, and system integration, forming a collaborative innovation ecosystem.
Industrial Significance and Future Outlook: Reshaping the Global AI Computing Power Landscape
This cooperation is not only a powerful alliance between enterprises, but also a model of Sino-German technological collaborative innovation. A German Federal Ministry for Economic Affairs and Climate Action official stated at the laboratory inauguration ceremony: "This project will promote the in-depth integration of European AI technologies with Chinese application scenarios, opening up new paths for global AI development."
Its strategic significance is reflected in three aspects:
- Technological Level**: Breaking the bottleneck of high-end GPU supply constraints, and driving China to achieve independent breakthroughs in key links such as chip design and advanced manufacturing processes.
Industrial Level**: Driving the upgrading of upstream and downstream industrial chains, and it is expected to form a 100-billion-yuan industrial cluster within five years, radiating ten major industries including intelligent manufacturing and smart cities.
International Influence**: Gradually building a pattern of "Chinese standards + global applications" through technology export and standard cooperation. For example, projects for co-constructing AI computing power infrastructure have been launched with Southeast Asian countries.
Looking ahead, with the AI.GPU technology solution as the fulcrum, Dishan Technology strives to build the joint laboratory into an important global source of GPU technological innovation within five years. The goals are to achieve three major breakthroughs: first, entering the top 3 in the world in terms of computing power performance; second, increasing the localization rate to 80%; third, building an AI solution library covering 100 industry scenarios. With technological iteration and ecological improvement, China's AI industry will truly realize the vision of "using independent computing power to solve China’s problems and create global value".
Computing power is productivity, and innovation is the future. Dishan Technology is writing a new chapter in the autonomy of China's high-end computing power, injecting surging "Chinese core" momentum into the artificial intelligence era.