Dishan Technology's Intelligent Visual Sensor Chip: Leading the Perception Revolution and Empowering the Intelligent Future
Overview of Dishan Technology's Image Sensor Business
In an era marked by the rapid advancement of artificial intelligence, autonomous driving, intelligent security, medical imaging, and consumer electronics, image sensors—serving as the core perceptual organs that enable machines to "see" the world—are playing an increasingly pivotal role. From the camera functions of smartphones to the visual perception of self-driving vehicles, from high-precision imaging in medical devices to intelligent recognition by industrial robots, image sensor chips have become indispensable "eyes" for modern technology. As an innovative enterprise focusing on cutting-edge technology and high-end manufacturing, Dishan Technology has proactively ventured into the semiconductor manufacturing of image sensor chips. Leveraging an independently controllable process platform and systematic R&D capabilities, the company is committed to developing high-performance, highly reliable, and domestically produced image sensing "Chinese chips," fostering the autonomy and upgrading of China's intelligent vision industry. Amid the semiconductors sector's high technological barriers and fierce global competition, Dishan Technology is writing a new chapter for China's smart manufacturing, with "chips" as its medium.
Image sensors represent a technologically intensive and widely applicable key segment in the semiconductor industrial chain, and their performance directly dictates the perception accuracy and response speed of intelligent devices. Dishan Technology has designated image sensor chip manufacturing as one of its core strategic priorities, adhering to the development principle of "technological leadership and independent control" while focusing on wafer fabrication and advanced process development for CMOS Image Sensors (CIS). Beyond deepening its presence in traditional areas, the company is also looking ahead—prioritizing breakthroughs in core enabling technologies for high-end image sensors, such as Back-Side Illumination (BSI), Stacked architecture, pixel miniaturization, and low-noise imaging. For example, in 2022, Dishan Technology successfully developed and mass-produced a new generation of BSI-CIS, whose imaging quality meets internationally advanced standards and has been widely adopted in smartphones and industrial manufacturing equipment. Through sustained R&D investment, Dishan Technology has gradually filled the domestic gap in high-end manufacturing, broken the monopoly of foreign enterprises in the high-end CIS manufacturing space, and built a solid technological moat for China's intelligent vision industry.
In terms of business model, the company adopts a dual-driver strategy of "design-manufacturing synergy": on one hand, as an open foundry, it provides customized manufacturing services for domestic and international chip design firms to meet diverse market needs; on the other hand, it leverages its proprietary process platform to develop self-branded image sensors, achieving end-to-end control from technology to product commercialization. This "technology platform + product implementation" model not only ensures manufacturing flexibility but also provides a continuous validation ground for technological innovation, forging a unique competitive edge.
Dishan Technology has established a world-class specialized production line for image sensor manufacturing, with core technical capabilities covering the entire process from materials to packaging, forming robust technological barriers:
• BSI Process Platform: It overcomes the limitation of traditional Front-Side Illumination (FSI) structures—where light must pass through the circuit layer—by placing photodiodes beneath the circuit layer, significantly boosting quantum efficiency and low-light imaging performance. This technology enables sensors to capture clear images even in dark environments, making it particularly suitable for scenarios like smartphone night photography, security surveillance, and in-vehicle cameras. Dishan Technology's BSI process has been put into mass production, with product performance on par with top international standards.
• Stacked CIS Integration Technology: By vertically stacking the pixel layer and logic layer, it not only drastically reduces chip size but also significantly enhances data readout speed and image processing capabilities. This technology meets the requirements for high-frame-rate, high-resolution video capture, providing critical support for high-dynamic scenarios such as AR/VR devices and action cameras.
• Deep Trench Isolation (DTI) and Microlens Array Processes: Micron-level precision DTI technology effectively suppresses optical crosstalk between pixels and improves color reproduction. Combined with customized microlens array design, it further optimizes light focusing efficiency and expands dynamic range, enabling sensors to deliver fine image quality even in environments with alternating strong and weak light.
• Wafer-Level Packaging (WLP) and Chip Scale Package (CSP) Capabilities: Advanced packaging technologies are adopted to achieve chip miniaturization and high integration while reducing power consumption and costs. This capability offers an ideal solution for applications with strict size constraints, such as smartphones and wearable devices.
• Low Dark Current and High Dynamic Range (HDR) Process Optimization: Through material improvements and process innovations, dark current is reduced to an industry-leading level. Combined with multi-frame HDR synthesis technology, sensors can retain rich details even under extreme lighting conditions (e.g., nighttime or direct strong light), achieving imaging quality comparable to human visual perception.
These technological breakthroughs not only demonstrate Dishan Technology's international competitiveness in manufacturing processes but also open the door to the high-end market for domestic image sensors.
In the semiconductor manufacturing sector, yield and stability are core indicators of a factory's competitiveness. Dishan Technology's image sensor manufacturing base employs a full-process automated production system, deeply integrating Industry 4.0 concepts:
• Intelligent Manufacturing Platform: It integrates systems such as Manufacturing Execution System (MES), Equipment Automation Program (EAP), and Statistical Process Control (SPC), realizing full-process digital management from wafer incoming inspection to finished product testing. Each wafer is assigned a unique ID that records real-time data—including temperature, humidity, and process parameters—ensuring the production process is traceable, analyzable, and optimizable. Thanks to this intelligent manufacturing platform, Dishan Technology has significantly improved production efficiency, reduced operational costs, and enhanced product quality and reliability, thereby consolidating its leading position in the semiconductor manufacturing industry.
• Clean Production Environment: The core workshop meets ISO Class 5 (equivalent to Class 100 cleanliness) standards, equipped with high-efficiency air filtration systems and vibration control devices. This eliminates the impact of environmental factors such as dust and static electricity on micron-level processes, ensuring product yield and long-term reliability.
• Stringent Quality System: The company strictly adheres to international certification standards such as IATF16949 (automotive electronics), ISO9001, and ISO14001, establishing a full-lifecycle quality management system covering design verification, process monitoring, and finished product testing. All products must pass dozens of rigorous validations, including high-temperature aging tests, ESD protection tests, and reliability life assessments, ensuring stable operation in extreme environments ranging from -40℃ to 125℃ to meet the stringent requirements of high-demand scenarios such as automotive, industrial, and medical applications.
This "intelligent manufacturing + ultimate quality control" model enables Dishan Technology to maintain an industry-leading product yield, earning high trust from customers.
Image sensor chips manufactured by Dishan Technology have been deeply integrated into multiple fields, serving as the "visual engine" of the intelligent era:
• Intelligent Automotive: It provides ultra-wide-angle, low-distortion sensors for vehicle surround-view systems, supporting 360° panoramic perception with a resolution of up to 8 million pixels to ensure clear, distortion-free images. For Advanced Driver Assistance Systems (ADAS), it develops high-dynamic-range sensors that enable accurate obstacle recognition at night and under strong light, with a response time as low as 20 milliseconds to ensure real-time decision-making. In-cabin monitoring sensors support real-time analysis of driver status—including accurate detection of fatigue—to enhance driving safety.
• Consumer Electronics: In the smartphone sector, the company's small-pixel, high-resolution sensors help smartphone cameras break through the "100-megapixel" threshold. Low-power, high-frame-rate sensors developed for tablets and AR/VR devices deliver smooth virtual reality experiences.
• Security Surveillance: Ultra-low-illumination night vision sensors can capture clear images even in starlight conditions, while wide-dynamic-range sensors accurately restore details in strong light and backlight scenarios. These provide "sharp eyes" for urban security and smart transportation.
• Medical Imaging: Miniaturized, high-sensitivity endoscopic image sensors support precise minimally invasive surgical procedures. Sensors in portable ultrasound devices enable high-definition real-time imaging, advancing primary medical diagnosis capabilities.
• Industrial Vision: High-resolution, anti-interference sensors developed for machine vision systems empower industrial quality inspection, automated sorting, and precise drone navigation, driving the upgrading of intelligent manufacturing.
Through in-depth strategic cooperation with numerous leading module manufacturers and terminal equipment suppliers, Dishan Technology's products have been mass-deployed in flagship products of renowned brands such as Huawei, Xiaomi, and BYD, becoming a benchmark for localization replacement. Beyond standard products, the company also offers rapid customized development capabilities, able to optimize pixel structures, packaging solutions, and interface protocols according to customer needs to deliver one-stop solutions from chips to modules.
Against the backdrop of increasing volatility in the global semiconductor supply chain, Dishan Technology attaches great importance to Business Continuity Management (BCM) in manufacturing, building a multi-dimensional resilience guarantee system:
• Multi-source Supply Chain Network: A "N+1" backup strategy is adopted for key materials and equipment. The company has established strategic cooperation with world-leading suppliers while actively nurturing domestic alternative suppliers to mitigate geopolitical risks.
• Emergency Response Mechanism: A spare parts library for key equipment and an off-site data backup center have been established. Emergency plans for extreme events—such as natural disasters and cyberattacks—are formulated, and regular simulation drills for "black swan" events are conducted to ensure production lines can resume operation within 48 hours.
• Flexible Capacity Allocation: Dynamic production line scheduling is achieved through a digital production planning system, enabling rapid switching of process nodes and product models according to market demand to flexibly respond to order fluctuations.
• Green Manufacturing and ESG Practices: Energy-saving production equipment and renewable energy are adopted, and wastewater and waste gas treatment processes are optimized. By practicing the concept of sustainable development, the company enhances the long-term stability of the supply chain.
This forward-looking supply chain management enables Dishan Technology to demonstrate strong risk resistance amid industry fluctuations, ensuring the stable delivery of customer orders and securing long-term cooperation with global clients.
Faced with the boundless possibilities of the intelligent era, Dishan Technology will continue to increase R&D investment and deploy more disruptive cutting-edge technologies:
• Event Camera: Breaking through the limitations of traditional frame rates, it captures dynamic changes in real time through an "event-triggered" mode, opening up new pathways for high-speed scenario perception and low-power applications.
• SPAD Image Sensor: Based on Single-Photon Avalanche Diode technology, it develops high-sensitivity direct Time-of-Flight (dToF) sensors, empowering lidar and 3D vision systems to support autonomous driving and metaverse interaction.
• Multispectral Imaging Technology: Integrating visible light with infrared and ultraviolet bands, it develops cross-border applications such as environmental perception and health monitoring, expanding the perceptual dimensions of image sensors.
• Wafer-Level Optical System: It integrates optical components—such as microlens arrays and filters—with sensors for co-manufacturing, achieving "system-on-chip" level optical performance and driving breakthroughs in miniaturization and integration.
The company plans to invest in building a new generation of specialized image sensor manufacturing lines within the next three years, introducing advanced process equipment such as EUV lithography to further enhance production capacity and process precision. Meanwhile, it will deepen cooperation with universities and research institutions, establish an industry-university-research-application collaborative innovation platform, and accelerate the transformation of technological achievements.